Durable Heat Resistance Consumable for BGA SMD SMT IC SMT Patch Adhensive Red Glue Stencil Repair

Label:Yes Curing Temperature: up and down heating temperature 150 degrees Suitable for: BGA SMD SMT IC repair, etc Capacity: 30ml Brand new and high quality Curing Time: 95 seconds

Features: 1. No drawing, smearing and pollution phenomena appeared. 2. With strength adhesiveness to bonding variety of surface mount components . 3. Excellent storage stability and good heat resistance.

Notice: 1. The real color of the item may be slightly different from the pictures shown on the website caused by many factors such as brightness of your monitor and light brightness. 2. Please allow slight manual measurement deviation for the data. Thank for your understanding. 3. 1cm=0.39''.

Package Included: 1x 30ml Red Glue 1x Needle