Splash Resistant Solder Protective Pad For Preventing Splattering And Clean Tinning In High Temperature Applications

Features: This solder mask pad prevents solder pastes splattering and stencil bulging during reflow soldering, ensuring clean, uniform coverage on PCBs for flawlessly electronic assembly. Crafted from plastic with high temperature resistance, it withstands soldering heat environments and offer impacts protective using clear glass like properties for long lastingly reliability. Designed for electronics engineers, hobbyists, and technicians who regularly perform soldering tasks, providing essential safety and precise in their workflow.

Ideal for use in PCB stencil applications, rework stations, and DIYer projects where controlled solder pastes deposition is critical to avoid messy spills and errors. Effortlessly place this splash resistant pad directly over the stencil for instantly protective, streamlining your soldering process while maintaining board integrity and cleanliness.

Specifications: Component:Plastic Product name: explosions-proof tin gasket CPU dedicated: 20x20mm Power IC dedicated: 10x10mm/0.39x0.39inch Power IC dedicated: Approx.20x20mm/1.09x0.79inch

Package Includes: 1pcs Solder Pad

note: 1.Please allow 1-2cm errors due to manual measurement, make sure that you donot mind befores you order. 2.Due to the differences between different monitors, the picture may not reflect the actual color. Thanks for your understandings.