Diam Thermal Conductive Heatsink Plaster Viscous Adhesive Compound Glue for PC GPU IC Accessories

Specifications: Heatsink Plaster Thermal Conductive Glue. Thermal properties, strong adhesion. Viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed), removed after wipe clean with paper towels.

Type: Heatsink Plaster Melting Capacity: 0 (200 Degree Celsius/ 24Hours) Evaporation: 0.001% (200 Degree Celsius/ 24Hours) Thermal Conductivity: > 1.2W/m-K Thermal Impedance: < 0.06 Clotting time: 3min (25 Degree Celsius) Strength of Connected Buildings: 25kg Insulation Coefficient: > 5.1 Dissipation coefficient: